"MINATEH" company was founded as a group of companies engaged in complex equipment of enterprises of technological and analytical equipment in the field of microelectronics, semiconductor manufacturing and research, nanotechnology, and for ensuring conformity of production equipment, including materials. Over the years, the company and our employees managed to acquire considerable experience in co..."MINATEH" company was founded as a group of companies engaged in complex equipment of enterprises of technological and analytical equipment in the field of microelectronics, semiconductor manufacturing and research, nanotechnology, and for ensuring conformity of production equipment, including materials. Over the years, the company and our employees managed to acquire considerable experience in cooperation with companies and manufacturers high-tech equipment for the production and research in microelectronics and nanotechnology field, as well as in specific areas of research. The work has led to numerous deliveries of the latest technological and analytical equipment for the leading industrial enterprises and institutions in Russia, as well as the signing of a number of dealer agreements with global manufacturers of semiconductor equipment. The company "MINATEH" today - it is harmoniously working professional team, able to perform tasks of varying complexity, and offer the best solution for industrial applications as well as for complex tasks of development and research. Always glad to send our professionalism and experience to solve your problems.Lithography, Maskless lithography, Maskless alingers, Mask Aligners, Spin coaters, Plasma etchers, Plasma Deposition, Atomic layer Deposition, ALD, Vacuum deposition, PVD, Rapid Thermal annealing, Wafer polishing, Wafer lapping, diamond slury, polishing pads, Photoresist coating, Photoresist devepoping, Nanopattering, Nano lithography, laser ellipsometrs, spectroscopic ellipsometers, reflectometers, Film thickness measuremetns, 3D optical profilers, Optical profilometry,Thin film characterization, by eddy current testing technology, plasma cleanning, plasma activation, micro assembling, probe station, DC probe station, RF probe station, wafer thinning, Active Vibration Isolation platforms, optical microscope, wafer inpspection, SEM, scanning electron microscope, table top scanning microscopes.